CEO Lisa Su: "Supply to Increase Significantly by 2027"… Supply Chain Planning Horizon Extended from 1-2 Years to 3-5 Years
MI455X to Feature Up to 432GB of HBM4… Samsung Named Primary Supplier for Next-Gen Products
Global semiconductor giant AMD is moving to sharply increase its supply of artificial intelligence (AI) accelerators. As the company accelerates its efforts to capture market share from Nvidia, the race to secure advanced memory, including high-bandwidth memory (HBM), is expected to intensify.
For Samsung Electronics, the primary supplier of HBM4 for AMD's next-generation AI accelerators, this expansion presents a substantial opportunity. With AMD signaling a significant supply surge for 2027 and CEO Lisa Su visiting South Korea, the spotlight has shifted firmly toward the domestic memory industry.
Lisa Su: "Supply to Increase Significantly by 2027"… Supply Chain Planning Horizon Extended to 3-5 Years
According to Taiwan’s Central News Agency (CNA) on the 6th (local time), CEO Lisa Su told reporters in Taipei, "We have been increasing supply since 2026, and we will significantly expand it in 2027."
In response to surging AI demand, AMD is shifting its supply chain strategy toward a longer-term outlook. "Demand is very, very high for the next few years," Su stated, adding, "As we anticipate exceptionally strong demand, we require more advanced wafer production capacity."
According to CNA, AMD has extended its supply chain planning horizon from the traditional 1-2 year cycle to a 3-5 year window. Su explained that the company is establishing longer-term partnerships to ensure that capacity across the entire supply chain can be secured precisely when needed.
To ramp up production of AI accelerators, AMD is intensifying its engagement with key Asian suppliers. During her visit to Taiwan, Su met with primary partners including Foxconn and TSMC. Beyond TSMC, back-end packaging firms and substrate suppliers are also expanding their capacities to accommodate AMD’s production targets.
Memory supply, particularly for HBM, remains tight. AMD is currently coordinating necessary volumes for AI server HBM and memory for CPUs and PCs with its suppliers and customers. This proactive engagement reflects a strategy to secure essential components, from advanced wafers to memory, well in advance of production scaling.
MI455X to Feature Up to 432GB of HBM4… Samsung as "Primary Supplier"
AMD’s production expansion is likely to translate directly into additional orders for Samsung Electronics, which has already begun supplying HBM4.
Samsung and AMD signed a Memorandum of Understanding (MOU) in March to collaborate on next-generation AI memory. Samsung was selected as the primary supplier of HBM4 for AMD’s upcoming "Instinct MI455X" AI accelerator. Samsung’s HBM3E is also utilized in the previous-generation MI350X and MI355 series.
A single MI455X unit is equipped with up to 432GB of HBM4. As AMD scales up AI accelerator production, the required volume of HBM4 grows accordingly. Having commenced mass production shipments of HBM4 in February, Samsung is well-positioned to meet the demands of AMD’s next-generation products.
The synergy between AMD and Samsung extends beyond HBM. The companies are discussing the integration of Samsung’s DDR5 memory into AMD’s next-generation server processors and AI systems, with potential future collaboration in the foundry sector.
Should AMD successfully increase its shipments of AI accelerators, the scope of its partnership with Samsung could expand from HBM4 to encompass server DRAM and foundry services.
Wafers from Taiwan, Memory from Korea: AMD Expands Supply Chain
AMD’s production hike may also provide opportunities for SK hynix to secure additional demand. CEO Su noted that the company is working closely with major players to secure the necessary memory volumes. Reuters, reporting on Su’s visit to South Korea, highlighted both Samsung Electronics and SK hynix as key memory providers. No official meeting between Su and SK hynix executives during this trip has been disclosed.
Following her schedule in Taiwan, Su traveled to South Korea. During her previous visit in March, she toured Samsung’s Pyeongtaek campus and signed the MOU for next-generation AI memory cooperation with Jeon Young-hyun, Vice Chairman of Samsung Electronics.
During this visit, Su is expected to discuss expanding cooperation with the Korean AI semiconductor ecosystem, including meetings with domestic Neural Processing Unit (NPU) companies. She is also scheduled to attend an AMD event in Yongsan, Seoul, later this afternoon.
With AMD extending its supply chain planning horizon to five years, the industry expects a fierce battle for HBM supply as production ramps up in 2027. For Samsung Electronics, which has secured its position as the primary HBM4 supplier for the next-gen MI455X, AMD’s push to challenge Nvidia represents a significant opportunity for sustained volume growth.
